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Updated by Addison Engineering on May 30, 2015
Headline for Ceramic Packages
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Ceramic Packages

Addison Engineering stocks over 3.5 million ceramic packages and in excess of one-million metal alloy lids. These include side braze, pin grid array, leadless/leaded chip carriers, flatpacks, headers, cerdip, cerpac. Our large inventory allows you to select from a variety of different configurations. The packages are Kyocera and NTK manufactured. The lids are gold plated and have gold-tin eutectic preforms attached. We specialize in both small and large orders and can typically ship within 24 hours.

For more info, please visit : http://www.addisonengineering.com/ceramic-packages.html

Ceramic IC Packages and Multilayer Substrate - Addison Engineering

Kyocera and NTK manufactured ceramic packages and metal alloy lids. we are suppliers of Side braze, pin grid array, chip carriers, flatpacks, headers, cerdip .

ceramic packages Addison Engineering

ceramic packages-Kyocera and NTK manufactured ceramic packages and metal alloy lids. we are suppliers of Side braze, pin grid array, chip carriers, flatpacks, headers, cerdip .