Future Electronics

https://www.futureelectronics.com/m/hirose-electric. Hirose continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies in Europe, Asia and North America.

https://www.futureelectronics.com/m/nxp. NXP offers complete end-to-end solutions for enabling the new generation of smart, interoperable home devices. No more closed ecosystems, no more headaches when connecting new devices to your network.

https://www.futureelectronics.com/resources/featured-products/microchip-silicon-carbide-power-solutions. Microchip explains how SiC can reduce the cost of an application. SiCsemiconductors improve system efficiency, increase high power density, minimize cooling requirements, and reduce system size, weight and cost.

https://www.futureelectronics.com/resources/featured-products/microchip-silicon-carbide-power-solutions. Microchip explains about the future of Silicon Carbide semiconductors. SiC semiconductors are three times more thermally conductive than silicon and enables higher voltages, extremely low switching losses improving system efficiency.

https://www.futureelectronics.com/resources/featured-products/microchip-silicon-carbide-power-solutions. When compared to silicon IGBTs, SiC MOSFETs can reduce switching losses by over 70 percent. Learn more about Microchip’s broad portfolio of SiCdevices, including MOSFETs, diodes, gate drivers and our new, industry-leading, 3.3 kV SiC MOSFET.

https://www.futureelectronics.com/m/microchip. The Microchip PIC16F18076 device family of MCUs contains a robust suite of digital and analog Core Independent Peripherals (CIPs) that enable cost-sensitive sensors and real-time control applications.

https://www.futureelectronics.com/resources/featured-products/infineon-optiga-trust-m-express-iot-security. This video shows the OPTIGA™ Trust M IoT Security Development Kit, which is the easiest way to develop and evaluate end-to-end security use cases for your IoT devices.

https://www.futureelectronics.com/m/taiyo-yuden. TAIYO YUDEN's multilayer ceramic capacitors are manufactured with advanced technologies and production systems to accurately layer several hundred dielectric sheets with a thickness of 1 μm or less.

https://www.futureelectronics.com/m/taiyo-yuden. Learn about TAIYO YUDEN's MLCC and its technology.

https://www.futureelectronics.com/m/power-integrations. Power Integrations announces two new members of the InnoSwitch3-AQ product family, the automotive industry's first AEC-Q100-qualified 1700 V switching power supply solution.

https://www.futureelectronics.com/m/nxp. The NXP MCX N Series are high-performance, low-power microcontrollers with smart peripherals and accelerators providing the ultimate balance of performance and power consumption.

https://www.futureelectronics.com/blog/techventures/stmicroelectronics-stm32wb-mcu. Do you need to embed wireless connectivity inside your products? If you have chosen to go with 2.4 Ghz radio protocols like Bluetooth, Zigbee or Thread, then the STM32WB from STMicroelectronics is the perfect wireless MCU for you! This series is the latest innovative and versatile solution for a wide range of connected devices.

https://www.futureelectronics.com/m/infineon. Smart technology requires smart management. Cyber security is vital with the IoT and end products. Watch the latest innovations. OPTIGA Trust M Express automates IoT device certification registration and provisioning, offering faster time to market.

https://www.futureelectronics.com/m/infineon. The IFX Automotive portfolio is perfect where applications require higher safety, reliability, and robust semiconductor solutions. Watch what is empowering this change and how the broad Infineon portfolio can help reduce your time to market with their complete solutions and reference designs.

https://www.futureelectronics.com/m/infineon. At Electronica 2022 Infineon released the XMC7000, robust industrial MCU designed to help designers optimize their end products to meet the dynamic and demanding business conditions of industrial applications. The robot demo showcased the real-time control that the XMC7000 enables for high end industrial communications.

https://www.futureelectronics.com/resources/ftm/wide-bandgap-solutions. Silicon Carbide (SiC) promises huge efficiency improvements, and it’s the exploding trend in power electronics. But why is it so difficult to get hold of? Paul Klausner from onsemi takes us through the process of manufacturing SiC and answers the question as to whether it will replace Silicon or if there is place in electronics for both.

https://www.futureelectronics.com/m/stmicroelectronics. Watch the latest STM32WB release, proving Wireless just got Better. This solution enables customers to have an easy transition to embed an ultra-low power radio transmitter with the possibility to implement several protocols to their projects. This makes it easy for designers to easily incorporate RF and wireless connectivity using either modules or silicon solutions.

https://www.futureelectronics.com/m/renesas. RISC-V is an open-source architecture and Renesas has recently released a 64 bit MCU with 1 Ghz performance. We discussed with SteffanoPassoni and Markus Vomfelde how RISC-V is perfect for IoT Edge solutions or optimizing motor control to save energy.

https://www.futureelectronics.com/m/ams-osram. If you require optical solutions for sensing or imaging, then ams OSRAM combine illumination and sensing with optimised products. Watch the changes since last Electronica, and at the forefront are the developments in optical sensing. We focussed on the Mira 220 imaging chip and module which allow a complete integrated system to allow easy design and time to market.

https://www.futureelectronics.com/m/c&k. Recently C&K became part of the Littelfuse family expanding the portfolio to incorporate high performance electromechanical switches as well as interconnect solutions. We spoke to Ben Zheng at Electronica about this expansion how it services automotive, industrial, and aerospace industries.

https://www.futureelectronics.com/m/infineon. In the EU, USB type-C will be the common charging cable for small electronic devices by the end of 2024. Manufacturers need to start moving over now. Infineon are enabling power delivery up to 240 W through one USB type-C connector, standardisation can prevent a lot of e-waste. Their Co2 sensor can tune air quality in HVAC systems.

https://www.futureelectronics.com/resources/featured-products/microchip-bare-metal-programming-attiny1627. In the 2nd episode of the bare metal programming series for the AVR Tiny2, we will cover: - Creating a new project in MPLAB X IDE - Creating a new main.c file - Finding and using the device header file - Peripheral module structures.

https://www.futureelectronics.com/resources/featured-products/microchip-bare-metal-programming-attiny1627. In the 3rd episode of the bare metal programming series for the AVR® Tiny2 (ATtiny1627), we will cover: - Setting up an I/O pin as an output - Toggling an onboard LED every second using the delay function (blocking function).

https://www.futureelectronics.com/resources/featured-products/microchip-bare-metal-programming-attiny1627. In this 4th episode of the bare metal programming series for the AVR® Tiny2 (ATtiny1627), we will cover: - Setting up an I/O pin as an output - Setting up Timer/Counter A to overflow every 1ms.

https://www.futureelectronics.com/resources/featured-products/microchip-bare-metal-programming-attiny1627. In this 5th episode of the bare metal programming series for the AVR® Tiny2 (ATtiny1627), we will cover: Why would I want to only use interrupts?